Tom McMullen Week 3 18/2/2013 22/2/2013 LETI WEEKLY

Tom McMullen Week 3 18/2/2013  22/2/2013 LETI WEEKLY

Tom McMullen Week 3 18/2/2013 22/2/2013 LETI WEEKLY STATUS REPORT LETI wafer thinning project flow Phase 1 ID 1.0 Project Name Thin Wafer Assemblies Owner T. McMullen Days 0 Start End 3-Feb Week 1 10-Feb Week 2 17-Feb Week 3 24-Feb Week 4 3-Mar Week 5 10-Mar Week 6 17-Mar

Week 7 24-Mar Week 8 31-Mar Week 9 1-Feb 30-Sep LETI accpets CERN proposal 1.1 1.1.1 1.1.2 PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to Advacam LETI - 3D Send gds to LETI T. McMullen Send 2 FEI4b wafers to LETI R. Bates 1.1.3 Confirm step size on wafer and centre ofset variation on wafer 1.1.4 Layout and mask production 1.1.4 LETI LETI

First 2 wafers with micro bumps delivered to Advacam LETI Current Deliverable 10 5 1-Feb 29-Mar 1-Feb 8-Feb 5 1-Feb 6-Feb 5 1-Feb 6-Feb 10 49 1-Feb 11-Feb 12-Feb Deliverable 1: Microbumb gds files 2-Apr Target not met Deliverable 2: First 2 wafers

with micro bumps delivered to Advacam 5-Apr 12-Apr 19-Apr 26-Apr Action List Phase 1 and 2 Action What 4 5 Top metal align key information CERN purcahsing info for STFC 6 7 Further funding for flip-chip process Bow measurement set-up Who TMcM TMcM When 22/5/2003 14/2/2013 Rbates\Cbuttar 31/2/2013 TMcM 31/2/2013

Comment Email sent to Fabian and Maurice by Richard requesting info Contact Sandrine and ask for the invoice for STFC Richard awaiting information back from Hienze regarding this Visit SMC and set up program for bow measurement Highlights and issues LETI and CERN agree contracts Cash for flip-chip bonding We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps Receipt of purchase CERN feedback on receipt of purchase prior to the end of March was not possible with a DAI. An invoice can be created using EDH and needs to be confirmed if this will suffice. Top Metal layer gds information is required for the alignment scheme. Richard is trying to source this information but its painfully slow and holding up progress. Deliverable 1 has been missed due to this. LETI are still confident on meeting deliverable 2 provided we get this information ASAP. Micro-bumps are designed and and wafer mapping completed LETI wafer thinning project flow Phase 2 To be published in next report

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